Model KISS-101B “Keep It Simple Soldering” 12” x 12” PCB Platform
ADVANTAGES: The KISS-101B is used to solder through hole components on SMT boards within close proximity of adjacent components. This process overcomes the limitations of operator dependent soldering with a truly flexible automated molten solder delivery system. The KISS-101B couples high throughput with precise process controls. The programmable features provide the tools to set all process parameters, including flux deposition, immersion depths, pre-heat dwells, travel distances and speeds, solder temperature and wave height. Once set, the system will repeat precisely. The KISS-101B will out produce 4 or more operators soldering with an iron while significantly increasing the solder joint quality and to a predictable schedule. “You can expect a ROI of 3-4 months or less”
The KISS-101B is a low cost automated selective soldering machine featuring a lead alloy solder pot, spray fluxer and a programming camera, all in an enclosed superstructure. The KISS-101B includes the following standard features: FEATURES: • Universal PCB location rails. • Lead alloy solder pot and pump assembly (lead free available). • Precision flux applicator. • Look-up programming camera (used for manual fiducial location) • Heated Nitrogen to the solder nozzle. • PC with Windows O/S. • Rapid setup and time to “first production” using the machine “teach” functions. • 6mm and 12mm “Bullet” nozzles. • Programmable solder wave flow rate. • Set the time/temp profile for each individual component type for maximized process control and TAKT time. • Absolute control over all critical process parameters: - Solder temperature interlocked to within 2 degrees C. - Height, and travel speed of the solder wave. - Programmable initial pre-heat soak time • Will Process PCBs 12” x 12” unassisted • Step and repeat capability in both X and Y axis for multiple boards in a panel. • Set-up kit containing all necessary support tools. • One year guarantee covering the entire machine and two years for the solder pot and pump assembly.
PROGRAMMING: The initial programming is accomplished by one of two methods on the machine or with the optional off line KISSware….. On the machine use the set up camera viewed on the monitor and joystick function on the keyboard to set the flux and solder pattern in real time. Usually an average board can be programmed within 15 minutes. You can fine tune the X,Y and Z positions, speeds, solder wave height and other parameters to perfect the process. Optionally, at your desktop import a jpg. (photo) or the CAD file into the KISSware program. Pick the solder nozzle size (this becomes your curser). Choose the start/stop positions for all devices to be soldered. The process path becomes highlighted and script is automatically created for you. Circular or angular interpolation allows the soldering of large round arrays in a spiral pattern and connectors not perpendicular to the X-Y plane (see the KISSware data sheet and video).