供应Nodson-ACE选择性波峰焊           KISS-103

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江苏 苏州

    加工定制 品牌 ACE 型号 KISS-103
    用途 通孔元器件自动焊 接 别名 选择性波峰焊          



    ADVANTAGES:
    The KISS-103 is an automated, simple to use low cost selective
    soldering machine using the proven ‘traveling mini–
    solder wave”. It is used to flux and solder through hole
    components on SMT boards within close proximity of
    adjacent components. This process overcomes the limitations
    of operator dependent soldering with a truly flexible
    automated flux application and molten solder delivery system.
    The KISS-103 couples high throughput with precise process
    controls. The programmable features provide the tools to
    set all process parameters, including immersion depths, pre
    -heat dwells, travel distances and speeds, solder temperature
    and wave height. Once set, the system will repeat precisely.
    The KISS-103 will out produce 5 or more operators soldering
    with an iron while significantly increasing the solder joint
    quality and to a predictable schedule.

     

    FEATURES:
    The KISS-103 is a fully configured Selective Soldering Machine
    ready to produce your product. The KISS-103 includes
    the following standard features:
    • “Super Quick” motion for fastest processing times.
    • Safety cover with internal lighting and fume vents.
    • Universal PCB location rails with motor driven adjustment.
    • Solder pot and pump assembly.
    • 6mm and 12mm “Bullet” nozzles.
    • Heated Nitrogen to the solder nozzle.
    • Windows O/S with simple on or off line programming.
    • Rapid setup and time to “first production” using CAD importing
    or on the machine “teach” functions.
    • Programmable flux deposition.
    • Programmable solder wave flow rate.
    • Automated in process solder wave height check / adjust.
    • Automated solder pot level check and fill.
    • Manual fiducial alignment prior to starting a process.
    • Set the time/temp profile for each individual component
    type for maximized process control and TAKT time.
    • Absolute control over all critical process parameters:
    - Solder temperature interlocked to within 2 degrees C.
    - Height, and travel speed of the solder wave.
    - Programmable initial pre-heat soak time
    • Will Process PCBs 18” x 24” unassisted (flux and solder)
    and up to 18” x 42” with manual step over.
    • Step and repeat capability in both X and Y axis for multiple
    boards in a panel.
    • Set-up kit, on site installation and training included.
    • One year guarantee covering the entire machine and two
    years for the solder pot and pump assembly.

     

    SPECIFICATIONS:
    PCB Panel Size
    Minimum Maximum
    2” x 2” 18” x 24”
    (18” x 42” with manual step over)
    Safe “Keep Away” (distance to adjacent pads) 1mm
    Motion (Super Quick)
    • Z-Axis Accuracy/Repeatability +/-.002"
    Speed 0-4 inches/sec.
    • X and Y Axis Accuracy/Repeatability +/-.002"
    Speed 0-8” inches/sec.
    Solder Pot
    • Temperature PID proportioning (0-400°C) ± 2°C
    • Solder Capacity 30 lbs.
    • Pump PC controlled
    Controls PC with Windows O.S.
    Physical
    • Dimensions 60" wide x 62" deep x 54" high
    • Weight 800 lbs.
    Facilities
    • Power 120VAC/1 Ph/60 Hz 15 amps
    • Air 80 – 90 PSI
    • Nitrogen 15 - 50 CFH @ 60 - 70 PSI
    • Exhaust 350 CFM recommended
    (2) 4” dia. Take-offs at rear panel

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