ADVANTAGES: The KISS-103 is an automated, simple to use low cost selective soldering machine using the proven ‘traveling mini– solder wave”. It is used to flux and solder through hole components on SMT boards within close proximity of adjacent components. This process overcomes the limitations of operator dependent soldering with a truly flexible automated flux application and molten solder delivery system. The KISS-103 couples high throughput with precise process controls. The programmable features provide the tools to set all process parameters, including immersion depths, pre -heat dwells, travel distances and speeds, solder temperature and wave height. Once set, the system will repeat precisely. The KISS-103 will out produce 5 or more operators soldering with an iron while significantly increasing the solder joint quality and to a predictable schedule.
FEATURES: The KISS-103 is a fully configured Selective Soldering Machine ready to produce your product. The KISS-103 includes the following standard features: • “Super Quick” motion for fastest processing times. • Safety cover with internal lighting and fume vents. • Universal PCB location rails with motor driven adjustment. • Solder pot and pump assembly. • 6mm and 12mm “Bullet” nozzles. • Heated Nitrogen to the solder nozzle. • Windows O/S with simple on or off line programming. • Rapid setup and time to “first production” using CAD importing or on the machine “teach” functions. • Programmable flux deposition. • Programmable solder wave flow rate. • Automated in process solder wave height check / adjust. • Automated solder pot level check and fill. • Manual fiducial alignment prior to starting a process. • Set the time/temp profile for each individual component type for maximized process control and TAKT time. • Absolute control over all critical process parameters: - Solder temperature interlocked to within 2 degrees C. - Height, and travel speed of the solder wave. - Programmable initial pre-heat soak time • Will Process PCBs 18” x 24” unassisted (flux and solder) and up to 18” x 42” with manual step over. • Step and repeat capability in both X and Y axis for multiple boards in a panel. • Set-up kit, on site installation and training included. • One year guarantee covering the entire machine and two years for the solder pot and pump assembly.
SPECIFICATIONS: PCB Panel Size Minimum Maximum 2” x 2” 18” x 24” (18” x 42” with manual step over) Safe “Keep Away” (distance to adjacent pads) 1mm Motion (Super Quick) • Z-Axis Accuracy/Repeatability +/-.002" Speed 0-4 inches/sec. • X and Y Axis Accuracy/Repeatability +/-.002" Speed 0-8” inches/sec. Solder Pot • Temperature PID proportioning (0-400°C) ± 2°C • Solder Capacity 30 lbs. • Pump PC controlled Controls PC with Windows O.S. Physical • Dimensions 60" wide x 62" deep x 54" high • Weight 800 lbs. Facilities • Power 120VAC/1 Ph/60 Hz 15 amps • Air 80 – 90 PSI • Nitrogen 15 - 50 CFH @ 60 - 70 PSI • Exhaust 350 CFM recommended (2) 4” dia. Take-offs at rear panel